A mechanical/electronic apparatus that assesses your product at various levels, ensuring the PCB's functionality aligns with design specifications. This is particularly vital when selling PCBs. Testing each one individually can be time-consuming, especially if you need to hook up a lot components. If this process takes around 20 minutes per PCB, imagine a large batch of 1000 PCBs, it becomes a significant challenge, expense and liability. However, a well-designed test jig streamlines this process, reducing testing time to a fraction of manual tests.
Socket | CAPABILITIES | Description | Available |
PACKGE ON PACKAGE TEST (POP SOCKET) | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty Available 0.20mm pitch array | Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity |  |
WLCSP MULTI PARA TEST SOCKET | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array For wafer level packaging testing (a full functional test) 2 (TP + BP) piece socket design for cost saving purpose |  |
BURN IN SOCKET (RELIABILITY TEST) | Design : 12 hours Fabrication : 2 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array Burn-in Test Sockets are make of high grade Engineering plastic to provide high strength with compact overall sizes. High performance probes assures high test yields with lower test costs. |  |
CAMERA MODULE (SIDE CONTACT SOCKET) | Design : 72 hours Fabrication : 5 days Inspection : 24 hours Delivery : 2 weeks | Qualities : enclosed a warranty |  |
AP . MEMORY . SYSTEM LEVEL TEST SOCKET | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array In the range DC-50GHz 50ohms |  |
Socket | CAPABILITIES | Description | Available |
PACKGE ON PACKAGE TEST (POP SOCKET) | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty Available 0.20mm pitch array | Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity | |
WLCSP MULTI PARA TEST SOCKET | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array For wafer level packaging testing (a full functional test) 2 (TP + BP) piece socket design for cost saving purpose | |
BURN IN SOCKET (RELIABILITY TEST) | Design : 12 hours Fabrication : 2 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array Burn-in Test Sockets are make of high grade Engineering plastic to provide high strength with compact overall sizes. High performance probes assures high test yields with lower test costs. | |
CAMERA MODULE (SIDE CONTACT SOCKET) | Design : 72 hours Fabrication : 5 days Inspection : 24 hours Delivery : 2 weeks | Qualities : enclosed a warranty | |
AP . MEMORY . SYSTEM LEVEL TEST SOCKET | Design : 24 hours Fabrication : 3 days Inspection : 24 hours Delivery : within a week Qualities : enclosed a warranty | Available 0.20mm pitch array In the range DC-50GHz 50ohms | |