Multilayer Ceramic Capacitors (MLCCs) act as a ‘dam’ that charges and discharges certain amounts of electricity, and many layers must be stacked as thinly as possible in a thin interior to accumulate a lot of electricity.
Samsung Electro-Mechanics possesses high technological capability to produce high-capacity MLCCs stacked up to 600 layers. In the 5G era, the importance of MLCCs is expected to grow with the development of electronic devices, self-driving cars, and the expansion of IoT. In line with market trends,
Samsung Electro-Mechanics is striving to develop high-technology-intensive MLCCs that are ultra-small, ultra-high capacity/high reliability, and high quality.
MLCC for Wide Range Implementation
A general MLCC temporarily charges and removes noise in electronic circuits and is the most widely available chip-type capacitor.
The product line allows for realization of various sizes and a wide range of capacitance.
It also has the structural capacity to mount chips on a PCB at a high speed.
MLCC for Thin Devices and Modules
To accommodate thin devices or modules,
this can be mounted between the solder balls to reduce module thickness or secure the mounting area.
It can supply current quickly in a stable manner to high-speed APs of mobile devices
and is less susceptible to external environmental stress thanks to high-frequency noise removal.
MLCC with a High Tolerance to Mechanical Stress
Thermal and mechanical stress on the chip can be reduced by the ductile properties of soft termination,
which is resistant to stresses caused by board bending.
MLCC with Increased Durability
It is a product that applies stress-management technology against external deformation to prevent MLCC defects from taking place
when mechanical and thermal deformation of the PCB occurs. With greater durability than existing products,
it can be used in applications that require safety.
MLCC to Protect Circuits
Specially designed for use in protecting circuits from ESD, this product guarantees a higher level of ESD than general MLCC products.
It meets the IEC 61000-4-2 standard.
MLCC with The Highest Degree of Safety
Designed to prevent circuit malfunction even if the MLCC product is cracked and a short circuit occurs inside.
In addition, the product guarantees Board Flex 5mm and is the MLCC product with the highest degree of safety
among other products to prevent defects caused by PCB deformation.
Noise-Reducing MLCC
MLCC tremors can occur due to piezoelectric phenomena in electronic devices.
These tremors are transmitted to the substrate,causing the substrate to tremble, producing audible noise (20Hz~20kHz).
Low Acoustic Noise products are a solution that can effectively reduce this noise.
MLCC with Low Equivalent Series Inductance
MLCC with low equivalent series inductance (ESL) can be used in circuits with limited mounting area,
as a small quantity of MLCCs can sufficiently replace high-speed IC MLCCs.
MLCC that Combines Multiple Chips into a Single Chip
As various electronic products such as portable devices have gotten smaller,
it is a product that combines multiple chips into one to secure mounting space.
This reduces the cost of mounting and the ripple voltage.
MLCC with a High Tolerance to Cracking
A capacitor with a molded frame structure that reduces audible noise, reduces the mounting area for the same capacitance
when using a stacked structure, and is more resistant to cracking caused by PCB bending.
MLCC for Wide Range Implementation
A general MLCC temporarily charges and removes noise in electronic circuits and is the most widely available chip-type capacitor.
The product line allows for realization of various sizes and a wide range of capacitance.
It also has the structural capacity to mount chips on a PCB at a high speed.
MLCC for Thin Devices and Modules
To accommodate thin devices or modules,
this can be mounted between the solder balls to reduce module thickness or secure the mounting area.
It can supply current quickly in a stable manner to high-speed APs of mobile devices
and is less susceptible to external environmental stress thanks to high-frequency noise removal.
MLCC with a High Tolerance to Mechanical Stress
Thermal and mechanical stress on the chip can be reduced by the ductile properties of soft termination,
which is resistant to stresses caused by board bending.
MLCC with Increased Durability
It is a product that applies stress-management technology against external deformation to prevent MLCC defects from taking place
when mechanical and thermal deformation of the PCB occurs. With greater durability than existing products,
it can be used in applications that require safety.
MLCC to Protect Circuits
Specially designed for use in protecting circuits from ESD, this product guarantees a higher level of ESD than general MLCC products.
It meets the IEC 61000-4-2 standard.
MLCC with The Highest Degree of Safety
Designed to prevent circuit malfunction even if the MLCC product is cracked and a short circuit occurs inside.
In addition, the product guarantees Board Flex 5mm and is the MLCC product with the highest degree of safety
among other products to prevent defects caused by PCB deformation.
Noise-Reducing MLCC
MLCC tremors can occur due to piezoelectric phenomena in electronic devices.
These tremors are transmitted to the substrate,causing the substrate to tremble, producing audible noise (20Hz~20kHz).
Low Acoustic Noise products are a solution that can effectively reduce this noise.
MLCC with Low Equivalent Series Inductance
MLCC with low equivalent series inductance (ESL) can be used in circuits with limited mounting area,
as a small quantity of MLCCs can sufficiently replace high-speed IC MLCCs.
MLCC that Combines Multiple Chips into a Single Chip
As various electronic products such as portable devices have gotten smaller,
it is a product that combines multiple chips into one to secure mounting space.
This reduces the cost of mounting and the ripple voltage.
MLCC with a High Tolerance to Cracking
A capacitor with a molded frame structure that reduces audible noise, reduces the mounting area for the same capacitance
when using a stacked structure, and is more resistant to cracking caused by PCB bending.